半導體產業
Specifications |
|
1.Basic |
|
Dimension (2 Loadport) |
W2530 x L3000 x H2315 mm |
Dimension (4 Loadport) |
W2530 x L4670 x H2315 mm |
Weight |
220~300 kg |
Panel/Wafer transfer size |
300x300 ~ 625x625 mm |
FOUP Loader |
2 pcs / 4 pcs |
SECS/GEM |
GEM200 / GEM300 |
2.Power |
|
控制系統負載 |
3P 208 VAC 50/60 Hz;75A |
3.Non-Contact Alignment Ability |
|
Product Size |
300x300 ~ 625x625 mm |
Product Type |
Compound / Metal / Glass |
Detection range |
±12mm |
Detection accuracy |
±0.2mm |
5.Transfer |
|
Product Size |
300x300 ~ 625x625 mm |
Product Size |
Compound / Metal / Glass |
UPH |
100 pcs/hr |
X axis accuracy |
±0.2mm |
Robot Y axis accuracy |
±0.2mm |
Robot Z axis accuracy |
±0.2mm |
6.Quality |
|
ESD |
< 25V |
無塵等級 |
符合FS209 Class 100等級 |
Vibration |
≦0.3G (RMS.) |
7.Safety |
|
SEMI 認證 |
符合SEMI S2、S8、S10認證 |
設備結構認證 |
符合SEMI規範 |