半導體產業
Specifications |
|
1. EFEM Unit |
|
Dimensions(1 load port) |
W670 X L1780 X H2076 |
Weight |
480kg ~520 kg |
Wafer transfer Size |
300mm x 300 mm |
Foup Loader |
1 pcs |
SECS/GEM |
GEM 300 |
2.Power |
|
電力系統負載 |
3P,220 VAC ;60HZ ;25A |
3.Alignment ability |
|
Product Size |
300mm x 300mm |
Product Type |
Silicon / Glass |
Detection function |
非接觸式紅外線檢測, Notch 檢測 |
4.Transfer |
|
Product Type |
Silicon only |
Catch function |
Fork for Vacuum |
Robot |
Clean Robot:單ARM R axis Stroke =650mm、Z axis Stroke =300mm |
5.Quality |
|
ESD |
< 25V |
FFU |
AC 1Φ 200/220V±%10, Class 10~100 (HEPA風扇失效需立即停機報警)。 |
E84 Sensor |
For OHT |
Ionizer |
For Transfer window; 1pcs |
無塵等級 |
FS209 Class 10~100 |
6.Safety |
|
Area Sensor |
For Loadport safety door.; EMO:3pcs |
SEMI認證 |
符合E1.9、E15.1、E47.1、E57、E62、E63、E64。 |
Loadport |
SEMI規格300mmFOUP/ Auto Door FOSB |