面板產業
Reflow C/V Equipment Hardware Configuration |
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Items |
Description |
Referential Spec |
General |
Aluminum alloy die casting(Anodizing) |
W570 x L500 x H1380 |
Transport speed |
180~1800mm/min |
|
Transport weight |
380mm |
|
vacuum plant |
operation function: 3 times action |
|
Plant limit for (ABCD) face |
plant positioning accuracy ±0.5mm |
|
Power |
AC 1 Φ 200/220V% ±10 |
|
Material Handling |
Material |
Glass, Si, MC wafer, Glass+MC wafer, Si+MC wafer,Glass+Si |
Equipment Performance |
Uptime |
>95% |
Wafer transfer failure rate |
<10 PPM |
|
Unscheduled downtime |
<3% (By month) |
|
Scheduled downtime |
<2% (By month) |
|
MTBF |
> 500 hrs |
|
MTBA |
> 200hrs |
|
MTBR |
<3hrs |
|
Critical parts coverage |
100% local stock |
|
WPH |
30 |
|
Equipment Requirement |
Conveyor width |
Conveyor width adjustment (290 ~ 360mm) |
Aligner |
303mm±0.5mm |
|
SUS Chamber encapsulated System |
Fully SUS Chamber encapsulated System with low Nitrogen Atmosphere |
|
Transport hight |
920mm+/-20mm |
|
Speed regulation and control per circuit |
YES |
|
Flatscreen monitor and signal tower |
Three color |
|
Color |
White Paint |
|
CE package including components - safety |
YES |
|
Temperature limit |
70 ℃ > 100 ℃ |
|
SMEMA |
Interface for handling systems, SMEMA |